Sputtering Systems from MRC and the Upsilon Target Continue to Do the Heavy Lifting for Leading Companies and Institutions. People say the Gold Upsilon Sputtering Target from DHF Technical Products looks like a lot of things: A picture frame. A box. A rectangle. But if you look closely, you can also see part of a horseshoe. Which makes sense because the Upsilon Target has been essential in helping the workhorse of sputtering systems from MRC run beautifully for decades. Sputtering Systems Born to Run and Run and Run.
Evaporation sources are components used in the process of physical vapor deposition (PVD), a technique used to deposit thin films of material onto a substrate. Here’s an overview of three commonly used sources: 1. Alumina Coated Evaporation Sources 2. Tungsten Evaporation Baskets 3. Point Source Filaments
The new PCM301 Busy Bee combines the ceramic capacitance diaphragm technology with a pirani sensor in a single device to provide pressure measurements from 2.80E-05 to 1,125 Torr. Due to the use of the capacitance diaphragm sensor the gauge is gas independent for pressures above 7.6 Torr, allowing safe venting with any gas mixture. PCM301 is available with various fittings including 1/8 in. NPT male, NW16KF, NW25KF, 1 1/3 in. Mini-Conflat, 4VCR and 8VCR.
Whatever electron beam evaporation system you’re currently using, you can transform it into an automated system with Ferrotec’s new FerroVac controller. The FerroVac controller integrates automated vacuum control with gauge reading functionality. When combined with the Temescal EBC Electron Beam Controller and a Temescal power supply, you can update your legacy deposition workhorse with advanced full system-level, automated control of the vacuum pump and e-beam functions. It’s like adding a process auto-pilot — start a run and walk away!
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our editorial calendar which lists the topic for each issue.