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Electron-Beam, Ion-Beam and Magnetron Deposition and Coating Systems
Compiled by Terrence Thompson, Contributing Editor
This annual product showcase describes many examples of the thin-film deposition and coating systems used in a wide variety of production, R&D and other applications.
Versatile vacuum-based, thin-film deposition and coating systems just keep getting better and better. Cost-effective and efficient deposition technologies are available for a wide range of thin-film materials to provide end users with many options. Depending upon the system and technology selected, systems can form layers with thicknesses ranging from of a few nanometers to several microns.
Thin film deposition technologies can be physical, evaporative and sputtering systems, or chemical including gas and liquid phase processes. Some processes are based on glow discharges and reactive sputtering which combine physical and chemical reactions are known as physical chemical methods.
Thin-film deposition and coating applications are fast-growing, continuing to find new uses ranging from razor blade coatings to quantum-well lasers to superconductors. Advances in thinfilm technology for semiconductors, MEMS and photonic devices enable ongoing advanced device fabrication, advanced discrete and wafer-level packaging of microcircuits and optical devices. Applications such as hard-amorphous carbon deposition and metal-interconnect deposition schemes are widely used in semiconductor manufacturing. Other applications benefiting from extremely hard coatings are cutting and forming tools where coatings reduce friction and wear with coating materials such as TiN, CrN, TiCN and AlTiN.
Product Descriptions
In the following product descriptions, vendors make valid distinctions to focus on specific niche market segments so direct comparisons may be difficult. When in doubt, go to Vacuum Technology & Coating magazine’s home page at www.vactechmag.com and click on the advertiser links for additional details or telephone numbers for calling to discuss your specific application requirements. With their experience, they can help you make the right choices.
ATC ORION Series Deposition Systems — Compact, Cost Effective, Research Tools with Modular Design
AJA International, Inc.’s introduced its ATC ORION Series deposition system, a compact, feature rich, premium quality alternative for researchers with limited budgets. Derived from the heritage of the larger, highly popularATC Series Magnetron Sputter Systems, the ATC ORION offers a design approach that is unrivaled in today's market: All modules are field retrofitable including computer control. These compact tools are available with 1-10 Torr magnetron sputter sources and can be either HV or full UHV design. The integrated 2-inch magnetrons are special versions of the field proven A300-XP and Stiletto Series modular magnetron sputter sources (over 4000 of these sources operate worldwide). Substrate cooling/heating from LN2 to 1000°C, substrate rotation, substrate RF/DC bias, substrate Z motion, turbo load-lock, RF/ DC generators, pulsed DC, auto- matic closed-loop downstream pressure control and computer control are just a few of the available option modules. Finally, in the tradition ofAJA’s highly uniform, con-focal deposition designs, the ATC ORION delivers a minimum guaranteed ± 2.5% thickness uniformity over 4 inches for any material due to a special source design feature (patent applied).
ATC 1500-E HYBRID UHV Deposition Systems – Sputtering for E-Beam/K-Cell/Thermal/ Ion Beam/Anneal/B Field
AJA International, Inc. has delivered numerous, multi-chamberATC HYBRID deposition systems with a variety of deposition/ modification/analysis techniques such as on axis, confocal and off-axis magnetron sputtering, evaporation, oxygen anneal, trans- verse magnetic field application, ion beam assist, milling and oxygenation, RHEED and finally post deposition surface analysis. These UHV chambers are connected via UHV gate valves and magnetic linear transfer tools allowing multiple, incompatible processing steps to be performed on a single substrate without exposure to atmosphere.AJA International, Inc.’sATC andATC ORION SERIES deposition systems are always designed to allow attachment of appendage chambers thereby creating the possibility of future ATC HYBRID systems as single purpose tools are expanded.
ATC ORION-M Ion Milling System for 150 mm Diameter Substrates Priced Under $200K
AJA International, Inc.’s ATC Orion-M is sized for single 150 mm substrates and features a ± 90° tiltable, rotating, water-cooled substrate holder. Ion sources are flange mounted to the chamber's fliptop for ease of service. The system can be fitted with a Multi-functional ICP Plasma Source, a High Energy Capacitively Coupled Plasma Source or a tradition Gridded Ion Source.Vacuum Pumping can be Cryogenic or Turbomolecular with HC or Dry mechanical pumps. Options include SIMS endpoint detection, load-lock, biasable water cooled substrate holders, computer control and a variety of substrate heaters.
AJA International, Inc.
Scituate, MA
www.ajaint.com
Contact: William Hale, President
Tel: 1-781-545-7365
E-mail: topgun@ajaint.com
Integrity Series Evaporation System
The Denton Vacuum LLC Integrity series provides Evaporation technology using multiple resistance and electron beam gun configurations.  Chamber geometry is optimised for the specific application. IA processes, optical monitoring and sophisticated automation and controls are typical features of these machines. Various fixturing arrangements offer increased uniformity and flip-over tooling is available for coating both sides of a substrate. The Integrity has been supplied in chamber sizes from 20 to 80 inches for applications as diverse as ophthalmic coating, laser bar facet coating, precision optics and optical filters. The Explorer series offers small-scale manufacture and R&D application with various configurations in a small footprint. A single electronbeam gun can be configured with IAD and sputtering cathodes for development applications. Denton Vacuum is celebrating over 40 years as a leading supplier of thin-film coating equipment with an established range of systems offering flexibility and performance to meet the most demanding applications. Denton offers a unique combination of hardware configuration, automation and controls, and process assistance to create powerful depositions systems for industry and research.
Discovery and Explorer Series Sputtering Systems
The Denton Vacuum LLC Discovery series provides Sputter technology with a standard hardware configuration with a choice of 1, 2, 3, or 4 cathodes.  The Discovery series has proven to be extremely successful with over 80 units installed worldwide. Cathodes from 2 to 4 inches are standard. Systems can easily be upgraded in the field to add additional cathodes. DC and RF power are offered, along with a selection of loadlocks for single or multiple substrate transfer. Denton offers both confocal and perpendicular cathode arrangements. This allows the user to select between enhanced uniformity on single samples or for lift-off applications. The Discovery has been supplied in chamber sizes from 18 to 35 inches. The Discovery 550 is available with increased clean-room compatibility. The Explorer series offers small-scale manufacture and R&D application with various configurations in a small footprint. A choice of up to three cathodes can be configured.
Denton Vacuum LLC
Moorestown, NJ
www.DentonVacuum.com
Tel: 1-856-439-9100
E-mail: info@dentonvacuum.com
Portable Dry Vacuum (PDV) Pumps for Deposition
EBARA’s Portable Dry Vacuum (PDV) Series Dry Vacuum Pumps provides a clean, reliable vacuum for today's high tech manufacturing,  semiconductor, thin film, photovoltaic, biomedical and pharmaceutical industries. The PDV Series Dry Vacuum Pumps offers a low cost, oil free energy efficient vacuum pumping solution for clean applications. The PDV Series Dry Vacuum Pumps require no annual mainte- nance, offers a low cost of ownership and high return on investment. EBARA offers models PDV250, 8 CFM and PDV500, 18 CFM both pumps have an ultimate pressure of 3 mTorr. The PDV Series are air cooled, low vibration, quite running with serial communications that allows remote control and monitoring. The PDV Series are suitable for applications requiring clean reliability vacuum processing which typical use scroll and wet pumps.
EBARA Technologies, Energy Savings Dry Vacuum Pumps The ESR Series (Energy Saving Roots) are multistage dry vacuum pump engineered for application from clean to medium duty processes such as Load Lock, SEM, PVD, Ashing, Sputtering and Etch. The ESR Series covers a wide pumping speed range from 35 ~ 1,625 CFM with an ultimate pressure as low as 1 mTorr.
Built on EBARA's experience, the ESR Series vacuum pumps achieve a low cost of ownership by integrating precision  machining, multiple pumping stages, improved DC motors and motor controls. These enhancements reduce utility consumption (electrical power, cooling water, nitrogen, footprint) compared to AC motored pumps. Intelligent controls allows the ESR Series pumps to be tuned to the vacuum requirements and can be throttled down, be placed in an idle mode, when not used for processing. For clean application no nitrogen purge is required. A minimal amount of nitrogen purging along with the pump constructed out of NiResist (homogeneous steel alloy with high nickel content) makes the ESR suitablel for pumping corrosive gases.
EBARA designs and manufactures “dry” mechanical vacuum pumps. EBARA dry vacuum pumps provide a host of product enhancements including increased reliability, reduced clean room particulate load, low noise, low vibration, lower operating costs, and a low cost of ownership.
EBARA Technologies, Inc.
Sacramento, CA
www.ebaratech.com
Tel: 1-800-535-5376
E-mail: info@ebaratech.com
Electron Beam Gun and Ion Source Evaporation
Fil-Tech, Inc. supplies complete electron beam emitter assemblies for Temescal and Telemark guns. Fil-Tech also supplies individual emitter parts including filaments, insulators, beam formers, and anodes. Electromagnetic coil assemblies, OFHC crucibles, and crucible liners are also available from stock. Fil-Tech sells replacement parts for Veeco Commonwealth and Veeco Ion Tech, and Satisloh Ion Sources. Fil-Tech supplies ion source filaments, insulators, gas distributors, anodes, and cathode tips. Fil-Tech's parts will meet or exceed the original manufacturer's specification, are competitively prices, and available for immediate delivery.
Fil-Tech, Inc.
Boston, MA
www.filtech.com
Contact: G. Paul Becker
Tel: 1-617-227-1133
E-mail: paul@filtech.com
KDF 974i Sputtering System
The all-new KDF 974i tool, is another KDF innovation which now provides a larger 20” by 20” sputter area.  The 974i is an excellent choice for pilot production solar applications, or scaling up production rates from smaller KDF/MRC systems. The 974i is a horizontal configured tool that allows complete end user flexibility to handle unique substrate sizes, and shapes. This type of sputter down application increases and simplifies the uses for the tool since special substrate fixturing is generally not required. Uni- formity and utilization are not compromised as KDF maintains the proper pallet to cathode ratio as in all our systems. The base tool is configured with a high vacuum cryo pumped load lock along with heat, allowing for pre heating and faster cycle times. This load lock arrangement coupled along with the four 24” cathodes allows for an array of diversified processes and higher throughput offered in a single tool. The 974i is also available with a host of options to make it even more production specific, available options include but not limited to an integrated process RGA, back side gas cooling in RF etch mode, ERPP™ KDF’s planetary pallet operation, upstream and down stream gas control, as well as pulsed DC bias. All KDF systems utilize the latest in communications control and protocol this along with. KDF’s software Recipe Manager allows for the user to have complete access and control of all the hardware features associated with the tool. The 974i is compatible with and utilizes KDF’s full compliment of 744 specialty cathodes, including the Inset Cathode™ , Magterial Cathode™ , Mark II Cathode™ along with standard planar cathodes.
Ci Cluster Tool
After years of development and testing, KDF announces the release of its new Ci, Cluster Intelligence, cluster tool line. The Ci tools are offered in a four sided and eight sided package, both system types feature Brooks Marathon series vacuum handlers. KDF designed and offers these systems for niche market places and is able to handle 100 – 200 mm wafers. For unique sized substrates the tool will also handle wafer carriers as well. Currently KDF offers sputter PVD, etch, degas, and passivation modules in its line up. KDF's sputter module features the latest in Rotational Magnetron Cathode tech- nology coupled with out rotational anode stage which allows for film uniformities better then 1 %. Another KDF exclusive is a PBN/PG backside heater element capable of temperature up to 1000°C. With over 22 years of direct manufacturing and design KDF is a leader in the PVD market place.
KDF 8620i 3 Target Sequential RF Sputtering System
The KDF 8620i system is a 3 target sequential RF sputtering system. The base system is a turn key system that offer three 6 inch RF diode targets along with RF etch and RF bias. The 8620i is a manually loaded batch tool that is excellent for R&D as well as small scale production. This tool is run by a PLC control system coupled to a touch screen panel for simplistic operation. The standard tool is CTI cryo pumped and has all automated features for pump down, vent and cryo regeneration. The 8620i also has an ad- justable anode to cathode distance allowing even for more flexibility in process development. A full package of both MKS gauges and control instruments coupled with a VAT throttling gate valve provides precise control of both upstream and downstream pressure control. This system package provides precise control and flexibility for all your process gas needs.
844 i Large Area Sputtering System
The all new KDF 844 i is a large area system targeted at the demanding process requirements of high-density  interconnect, 300mm semiconductor wafers and flat panel displays. This all new system has been totally redesigned from the ground up and now utilizes some of the latest advances in today’s technology. The 844 i was conceived to meet increasing demand for higher throughput with larger substrates. Based on the company's production-proven platform of in-line sputtering systems, the 844 i offers manufacturers an efficient large area processor with the footprint of a small system. The tool features two processing palettes, allowing instantaneous change of wafer sizes and the ability to process both the front and back side of the wafer. Targets on the 844 i are available in a variety of high-efficiency formats. The tool has a target utilization rate of up to 60 percent.
KDF Electronic & Vacuum Services, Inc.
Rockleigh, NJ
www.kdf.com
Tel: 1-201-784-5005
E-mail: sales@kdf.com
PVD 75 R&D Vacuum System
The Kurt J. Lesker Company PVD 75 is a versatile, value engineered, R&D vacuum system which can be configured to suit a variety of thin-film deposition applications. Standard features include: a front loading box chamber, turbomolecular pump package, integrated touch screen control, and a fully enclosed “zero” cleanroom footprint when flush wall mounted. Source flange options include magnetron sputtering, electron beam evaporation, thermal evaporation and low temperature evaporation furnaces. To ensure new product reliability, the PVD 75 is built using proven process modules from other standard Kurt Lesker Company thin-film deposition systems.
AXXIS Thin-Film Deposition System for R&D
Kurt J. Lesker Co.’s AXXIS is a cost effective, versatile thin-film deposition system for R&D and  limited production applications. Although the AXXIS is a multi-technique system, it has a very small footprint. Its 304 SS chamber has a hinged front loading door, high vacuum pumping, enclosed frame, and safety interlocked operation. Standard deposition process modules are: magnetron sputtering, e-beam evaporation, and thermal evaporation. But the modular manufacturing approach allows easy adaptation to PECVD, plasma cleaning, and ion source installation. AXXIS produces single-layer and multi-layer films, and allows co-deposition. A variety of options are available including a Windows-based computer control system and a variety of substrate handling tools.
KJLC Box Coater Series
Kurt J. Lesker Co. manufactures a series of cost effective  Box Coater PVD systems where the demand is for high process throughput. Chamber sizes ranging from 24 to 48 inches allow substrate fixtures of vary ing shapes, sizes, and applications to be accommodated. The KJLC 3000 and HPD40 are suitable for a variety of PVD techniques such as magnetron sputtering, thermal evaporation, e-beam evaporation, or customized methods. Process options include: substrate heating/ cooling; substrate biasing; and ion source installation. High substrate throughput is assured by several pumping options including cryopumps, turbopumps, and “in-chamber” cryogenic pumps for water vapor. Closed loop control of process parameters and fully automatic operation is achieved through each system's computer control.
CMS Family of Deposition Systems
The Kurt J. Lesker Co. Combinatorial Materials Science (CMS), initially developed to facilitate drug research,  has been subsequently ap- plied to new thin-film materials synthesis to enhance effects such as GMR. Our CMS thin-film deposition tools extend ‘traditional’ thin-film methods using combinatorial techniques into the rapidly advancing field of Spintronics. The CMS tools are modular, easily configured high vacuum and UHV tools for combinatorial PVD. The standard platforms, CMS-18, CMS-24, and CMS-A, distinguished by chamber diameters, allow an ever greater variety of internal options. The standard PVD modules available are: magnetron sputtering, e-beam evaporation, k-cell sources, and thermal evaporation. But the CMS tools can be readily adapted to other techniques such as PECVD. All CMS Tools are available with load locks, specialized substrate stages, sequential or co-dep- osition capability, and a Windows-based comprehensive computer control system. Our modular manufacturing makes the CMS family highly reliable, exceptional versatile, cost effective, with a short delivery time.
LUMINOS Cluster Tool
Kurt J. Lesker Co.’s LUMINOS Tool is a multi-chamber thin-film deposition and analysis system for R&D or pilot production applications. Its central distribution chamber is surrounded by a maximum of six radial process modules. The standard process modules are: substrate load lock; mask library; magnetron sputtering; thermal evaporation; electron beam evaporation; plasma cleaning; thermal annealing; oxidation; and analysis. The LUMINOS Tool is designed for any thinfilm deposition, device fabrication, or analysis technique requiring in-vacuum transfer between chambers. Vacuum environments are high vacuum to true UHV. The baselevel LUMINOS tool has manual substrate transfer. However, automated substrate transfer and a Windows-based comprehensive computer control package are options.
SPECTROS™ Deposition System for R&D
Kurt J. Lesker Co.’s SPECTROS is a  versatile thinfilm deposition system for R&D investigations into small organic molecule devices.Applications include OLED, PLED and organic TFT structures. The single chamber system has both organic and metal evaporation sources, in situ mask changing, and a glove box interface. The typical SPECTROS system has four Lesker LTE (low temperature) organic evaporation sources and two (high temperature) metal evaporation sources. At its limit, SPECTROS can have eight organic sources and three metal sources simultaneously installed. Quartz crystal deposition monitors precisely control of film thickness and host/dopant ratios.A Windows-based, comprehensive computer-control package is included.
Kurt J. Lesker Co.
Clairton, PA
www.lesker.com
Contact: Duane Bingaman, Vice President, Sales and Marketing
Tel: 1- 412.387.9004 or 1-800-245-1656
E-mail: pvd@lesker.comor sales@lesker.com
Leybold Optics HELIOS Innovative Sputtering System
The Leybold Optics HELIOS sputtering tool is a flexible platform for fast,  precise and fully automated thin film coatings. Its specialty are high quality optical coatings featuring very low absorption and scattering. Excellent optical performance is ensured by the extremely dense, smooth, stoichiometric, and amorphous layers. Ultimate precision in layer growth control is facilitated by an optical monitoring system (option) for in-situ on-substrate measurements. HELIOS can be used for a wide range of optical coating applications, including edge, bandpass, color, and UV/IR cut filters as well as beam splitters and laser mirrors. Besides optical coatings, other dielectric coatings (oxides, nitrides) as well as metallic coatings can be easily produced, depending on the source configuration of the HELIOS. Applications include: precision optics; Optoelectronics; Sensors; and Telecom.
Leybold Optics SYRUSpro CFM High Performance Coatings for Digital Optics
Optical thin film coatings are a  key enabling technology for digital optics. Constantly increasing demands on image resolution, contrast, color definition, and brightness place exacting requirements on the optical filter performance. The Leybold Optics SYRUSpro CFM is an innovative and cost-effective thin film coating solution for high performance optical filters, tailored to fulfill current and future requirements in digital optics. The APSpro ensures shift-free UV/IR cut filters (top), and excellent filter performance with high transmission and low ripple (bottom). Outstanding uniformity and repro- ducibility is demonstrated by the data of five substrate positions distributed over the calotte radius, and 6 consecutive production runs. Note: Measurement without backside AR coating. Today’s filters meet a growing range of performance parameters and must be produced within ever-shorter dead-lines. This is why excellent quality is the basis for modern digital optics production.A costeffective thin film deposition system must also deliver increased pro- ductivity through consistently high throughput and high yields. Higher product requirements combined with lower cost of ownership demands all add up to an increasingly challenging business environment for the filter manufacturer.
Leybold Optics GmbH
Alzenau, Germany
www.leyboldoptics.com
Contact: Mrs. Isa Fröhling, Marketing Services
Tel: +49-(0)175-278 5617
E-Mail: if@three-for-you.com
Building Blocks for Vacuum Science & Technology
This 528-page catalog details MDC’s expanded line of high and ultrahigh vacuum components. From basic elastomer gaskets  to sophisticated instruments for e-beam evaporation, MDC provides dependable and reliable solutions for vacuum science and technology. MDC’s comprehensive product line includes: Flanges & Fittings- Del-Seal™ CF, Kwik-Flange™ ISO KF, Large-Flange, TM ISO LF...; Valves- Angle, Inline, Circular & Rectangular , Gate, Leak...; Roughing Components; Foreline Traps, Sorption Pumps, Del-Flex™ process line, stainless steel flexible hoses…; Electrical & Fluid Feed-throughs-Coaxial, Power, Instrumentation, Breaks & Envelopes...; Motion & Manipulation- Rotary, Linear, Multi-Motion, XYZ Stages, Load-Locks, Motors...; and Chambers- Surface Science, Bell Jars, Collars, Baseplates, Base Wells. MDC is committed to providing products and services that set the industry standard for customer satisfaction in quality, delivery and cost performance.
MDC e-Vap® and Re-Vap™ Evaporators
MDC produces state-of-the-art thin film vacuum coating equipment,  and offers a wide range of choices and options in both, standard off-the-shelf components and customize designs. MDC’s e-Vap® and Re-Vap™ product lines fully support electron beam or thermal evaporation methods. Featured products include the super economical and compact, 4 pocket, 3 kW, e-Vap® Mighty Source™ . Specifically tailored for pilot production, lab/R&D and the university marketplace, the Mighty Source™ provides the ideal deposition solution for your evaporation needs.
MDC Vacuum
Hayward CA
www.mdcvacuum.com
Contact: Jinny Royer
Tel: 1-510-265-3500 or 1-800-443-8817
E-mail: JRoyer@mdcvacuum.com
Customized Vacuum Chambers for Sputtering Systems, Metal Evaporation and Molecular Distillation
Myers Vacuum has been servicing systems worldwide since 1986, specializing in support of customized vacuum chambers for sputtering systems, metal evaporation, and molecular distillation. In addition, MyersVacuum specializes in equipment manufactured by the former CVC Products, Inc., providing service, technical support, parts, refurbishment, upgrades and modifications. Myers Vacuum is also a leader in the manufacture and repair of short-path molecular distillation systems and their components; a leading manufacturer of Oil Diffusion Ejector Pumps, vacuum measurement equipment, sensor tubes and automatic valve controllers. Myers Vacuum is also a top vendor of previously owned equipment.
Myers Vacuum, Inc.
Kittanning, PA
www.myers-vacuum.com
Tel: 1-888-780-8331 or 1-724-545-8331
E-mail: myersvacuum@myers-vacuum.com
Delivery Module Enables TEOS-based SiO2 PECVD
Using the Oxford Instruments-Austin Scientific’s Plasmalab® System100 and Plasmalab® System133 process tools, TEOS offers an alternative PECVD precursor to the commonly-used silane (SiH4.) The complete TEOS PECVD system enables high quality, conformal deposition of SiO2 for photonics, dielectric layers and other structures together with control of film stress, deposition directionality and degree of step coverage by controlling oxygen radicals. The TEOS delivery module offers an integrated purpose-designed solution with optimized heated delivery lines to ensure efficient, high-uniformity SiO2 PECVD processes and an easy source access and changeover. There is an optional glove-box which can be fitted onto the module for maximum safety and the module can be connected into a clean-room extraction system if required.
Atomic Layer Deposition Using FlexAL™ Systems
Oxford Instruments-Austin Scientific’s FlexAL™ product family offers a unique new range of flexibility and capability in the engineering of nanoscale semiconductor structures and devices by combining remote plasma ALD processes with thermal ALD in a single system. Loadlocked wafer entry and full 200 mm single-wafer capability add to the FlexAL™ tool’s ability to support the widest range of applications via the widest available range of precursors and materials. This product can be integrated into a cluster platform where required.
Oxford Instruments - Austin Scientific
Austin, TX
www.austinscientific.com
Contact: Todd Komanetsky
Tel: 1-512-441-6893
E-mail: Todd.Komanetsky@oxinst.com
SC 324 Systems—A Wide Range of Options Covering the Deposition Spectrum
The Semicore SC 324 Systems are available with a wide range of options covering the spectrum from full computer control to manual operation, from production runs to small R&D quantities. They are economical, feature fast loading and unloading, offer broad process flexibility, and accommodate a variety of substrate sizes, shapes, and materials. Their efficiency of design, ease of operation, and unmatched reliability make them an excellent choice for a wide range of production applications. We have enhanced the original design to improve the pumping performance. The new high vacuum isolation valve boasts a 10 year warranty. Our standard automation package combines data gathering and pump performance tracking software insuring a repeatable process every time.
SC 943 Reproduction of a Popular Horizontal Sputtering System
The Semicore SC 943 is a reproduction of a popular horizontal sputtering system. Our many years of remanufacturing these platforms have led us to make numerous improvements in the OEM design, including a better pallet in place sensor, stepper motor/encoder carrier motion system, optional load lock turbo pumping capability, improved pallet exchange function, and an improved hydraulic package. A less cluttered frame interior greatly improves maintenance access for enhanced support and up time, The new high vacuum isolation valve has a 10 year warranty. Our standard automation package combines data gath ering and pump performance tracking software insuring a repeatable process every time. The SC 943 is a reproduction of a popular horizontal sputtering system. Our many years of remanufacturing these platforms have led us to make numerous improvements in the OEM design, including a better pallet in place sensor, stepper motor/encoder carrier motion system, optional load lock turbo pumping capability, improved pallet exchange function, and an improved hydraulic package. A less cluttered frame interior greatly improves maintenance access for enhanced support and up time, The new high vacuum isolation valve boasts a 10 year warranty. Our standard automation package combines data gathering and pump performance tracking software insuring a repeatable process every time.
SC 1500 Series System In-Line Sputtering Deposition Systems
Semicore’s family of In-Line deposition systems includes the SC 1500 series Sputtering System. The system  provides an economical modular design to meet a variety of process and throughput needs. Configured with single pallet load locks or multiple pallet stackers, the SC 1500 accommodates loads up to twenty 300 mm wafers, or any other substrates you can fit on the 15 × 15 inch pallet. The load lock options include RF pre-cleaning or substrate heating up to 500 degree C in various vacuum regimes. The main process chamber can be populated with three magnetron assemblies or other arrangements of various target shapes and sizes. RF magnetrons, DC standard or pulsed magnetrons, as well as some very new deposition techniques are available. Continuous tip to tail pallet processing or multiple scan layered coatings are all possible and recipe selectable. All this capability comes with a versatile software package for tracking every possible recipe parameter to ensure a repeatable coating every time.
SC 4000 Large Chamber Volume Deposition Systems
The Semicore SC 4000 is one of our largest chamber volume deposition systems. This unit interior is almost 2 × 2 × 2  meters for large area coatings or high throughput applications, such as Solar PV, Optical, Military, Automotive, etc. The system supports various substrate tooling configurations, including web coating (Roll to Roll), Planetary, or your custom engineered aperture. It comes with a choice of several pumping packages and deposition configurations. The SC 4000 also comes with a wide range of controls and software that easily interface with other large material handling applications.
Semicore Equipment, Inc.
Livermore, CA
www.semicore.com/index.php/new-systems
Contact: Christopher A. Malocsay, Vice President
Tel: 1-925-373-8201
E-mail: malocsay@semicore.com
Orion Series Evaporation System
System Control Technologies designs and manufactures physical vapor deposition (PVD) thin film coating systems and components. Core technologies include thermal, and electron beam evaporation, RF/DC sputtering, ion plating, ion-beam sputtering, plasma deposition and ionassisted (otherwise known as “IAD” or “IBAD”) deposition. We serve a wide variety of markets including precision optics, fiber optics, displays, electronic devices, flat panel semiconductors, functional and decorative coatings, flexible circuits, electro-optics, storage media, MEMS and nano-fabrication, photovoltaics, compound semiconductors and defense industry applications. The Orion Series Evaporation System can handle optical, semiconductor or low temperature organic applications. Chamber sizes range from 500 mm to 1500 mm with multiple electron beam and thermal sources. Ion-assisted deposition and substrate pre-cleaning, plasma deposition and substrate pre-cleaning and a completely automatic system are featured.
System Control Technologies
Santa Clara, CA
www.systemcontroltechnologies.com
Tel: 1-408-988-0400
E-mail: sales@systemcontroltechnologies.com
Thin Film & Nanotechnology Magnetron Sputtering, Electron Beam & Thermal Evaporation Systems
Torr International, Inc. specializes in Thin Film & Nanotechnology Equipment. The current  range of products include Standard Table Top lowpriced Magnetron Sputtering systems for diverse applications, from specimen preparation for SEMs to R&D with metal, dielectric and polymer films to Custom-built multi-target sophisticated systems for special applications. We also manufacture Thermal and E-Beam Evaporation systems to suit customers' needs and specialize in Etching systems with different configurations for corrosive and standard applications. We serve a worldwide market in the areas of thin film deposition and etching as well as high vacuum technology. We also supply all the accessories needed for thin film deposition work.
Torr International, Inc.
New Windsor, NY
www.torr.com
Contact: Dawn Fugazzi, Business Manager
Tel: 1-845-565-4027 or 1-888-MAC-TORR
E-mail: torr@torr.com
Roll-Coating Equipment for R&D and Pilot-Scale Applications
ULVAC’s model SPW-030 rollcoating  system is designed for R&D and Pilot-scale production applications. Capable of processing a 300 mm-wide web, of various substrate compositions; either thin-gauge metal rolls, or various polymeric materials, the coater can be equipped with a combination of deposition sources. The SPW-030 can be equipped with up to four sputtering cathodes, and an electron beam evaporation source, for depositing materials of varying compositions. The main deposition drum can be either heated, or cooled, and the system can be equipped with a pre-treatment ion (bombardment) source. The system can be also equipped with additional cooling rollers and a film thickness monitor.
Thin-Film Battery Fabrication Equipment
ULVAC has developed a unique equipment suite for depositing all layers of materials required for the fabrication of  thin-film batteries (TFB). The cathode solid electrolyte layer and cathode current collector layers are formed using the cluster-type sputtering system (model: SME-200J). The anode layer is formed by evaporating lithium metal in an evaporation system (model: ei-5). The sealing/packaging layer is formed using a cluster-type evaporator-polymerization system (model PME-200). This Thin Film Battery integrated production system has been jointly developed by ULVAC, Inc. and ULVAC Materials, Inc. A combination of process chambers and deposition sources were selected from ULVAC’s broad product range to provide a suite of equipment ideally suited for TFB applications. In collaboration, Ulvac Materials has developed the appropriate high-density targets (lithium cobalt oxide and lithium phosphate) that optimize the performance with these systems.
ULVAC Technologies, Inc.
Methuen, MA
www.ulvac.com.
Tel: 1-978-686-7550
E-mail: sales@us.ulvac.com
Third-Generation NEXUS Ion Beam Deposition (IBD) System
The third-generation NEXUS Ion Beam Deposition (IBD) system incorporates Veeco’s award-winning deposition technology to  help data storage manufacturers dramatically increase yield, as well as meet the needs of multiple generations from current CIP to advanced CPP devices. It is also ideal for MRAM applications. The NEXUS IBD is designed to improve inboard/outboard symmetry, significantly reducing side-to-side imbalances. In addition, sharper takeoff angles and reduction of overspray increase sensitivity. Best of all, the NEXUS IBD can be integrated on a cluster platform with IBE, PVD and other technologies, and is compatible with the current installed base of Veeco deposition and etch cluster tools.
NEXUS Physical Vapor Deposition Systemt
Veeco’s high-rate alumina NEXUS® PVD-HR Physical Vapor Deposition System offers superior thickness uniformity and wafer-to-wafer repeatability without target poisoning. The system provides the flexibility and process tune-ability of ion-assisted deposition with the high-rate and reliability requirements of thick overcoat applications. The system is 200mm capable. Designed to provide arc-free and pinhole-free films, the PVD-HR incorporates “best-in-class” technology on a small footprint for a lower cost of ownership. As part of Veeco's NEXUS family, it can be integrated on a common hardware and software platform with complementary Veeco technologies, such as ion beam deposition, ion beam etch, and reactive sputtering.
Veeco Instruments, Inc.
Woodbury, NY
www.veeco.com
Contact: Fran Brennen, Senior Director of Marketing Communications
Tel: 1-516-677-0200, Ext. 1222
Email: fbrennen@veeco.com
SPECTOR™ Optical Coating System
Veeco's SPECTOR ™ Optical  Coating System sets the standard for precision optical thin-film deposition. The SPECTOR ™ system produces compact, low defect density films that are durable under the most harsh operating and environmental conditions. The system is extremely versatile in its application capabilities and therefore provides users with additional business leverage when market forces change direction. Proven SPECTOR ™ applications include, DWDM (100GHz, 50GHz), GFF, Rugate filters, and AR/HR for semiconductors devices and ultra-low-loss films.
Veeco Instruments, Inc.
Fort Collins, CO
www.veeco.com
Contact: Brian Knollenberg, Director of Marketing
Tel: 1-970-221-1807, Ext. 312
E-mail: bknollenberg@veeco.com
Custom Deposition Systems
YTI Thin Film Products and Services (Yeagle Technology, Inc.) builds and rebuilds new and used vacuum systems for PVD, CVD and PECVD in configurations customized to specific applications. Systems are available in bell jars, box coaters, load-lock, in-line, and batch with a range of sources including electron beam sources, thermal sources, ion sources and magnetron or diode cathodes (RF or DC). The company offers in-house automation technology and will integrate customer-supplied components as requested. With more than 30 years of vacuum experience and design capabilities YTI engineers analyze your process and deliver an excellent cost to performance system.
YTI Thin Film Products and Services
Ashford, CT
www.ytionline.com
Tel: 1-860-429-1908
E-mail: info@ytionline.com
Addendum
APRIL 2009 DEPOSTION SOURCES
SunSource ™ GEN II Linear Sputtering Sources with Kamlok ™ Fast Target Exchange System
Materials Science, Inc. SunSource GEN II magnetron sputtering sources include the Kam-Lok ™ (patent pending)  fast target change mechanism that eliminates target fasteners prone to galling and seizure – targets are exchanged quickly regardless of length. Gas injection through the cathode body and efficient cooling ensure uniform distribution, high rates and low pressure operation. A wide uniform target erosion area results in stable reactive sputtering, high target utilization and virtually no center material redeposition. They can be used in DC, pulsed DC, AC and RF modes. They are available in internal and flange mount configurations in lengths up to several meters in a variety of target widths.
SunSource ™ GEN II High Utilization Narrow Width Sources
A new line of Materials Science, Inc. SunSource GEN II magnetron sputtering sources with 90 mm wide targets featuring  35 to 40 wt% utilization during the useful target life has been developed. They are ideal for sputtering precious metals and expensive, hard to fabricate materials used in the production of photovoltaic devices. Good target utilization can be achieved even at very low power levels. An important benefit is that there is virtually no center material redeposition. These sources are a cost-effective alternative to rotary magnetrons in many applications. The plasma discharge is confined to the region above the target surface due to the highly balanced magnetic design. No strong stray electromagnetic fields are generated that promote arcing, substrate damage and heating from electron and ion bombardment and sputtering of the source itself. They are ideally suited for small vacuum web coaters. Distribution from the source is more easily matched to the circumference of the drum. Flange mount, internal mount and retrofit configurations are available with a variety of feedthrough and utility connection possibilities.
SunSource ™ Round Magnetron Sputtering Sources
Materials Science, Inc. SunSource ™ round sputtering sources are available in internal and  flange mount configurations with 4” to 8” diameter targets. Gas injection through the cathode body makes additional feed-throughs & manifolds unnecessary and allows low 10 -4 Torr range operation. An active plasma discharge on nearly entire target surface significantly reduces insulating film growth and arcing and promotes stable operation. Target erosion is uniform throughout the target lifetime without significant changes in distribution uniformity as the target erodes. Target utilization is 35 to 40 wt%. Power levels can exceed 500 watts/in 2 for directly water cooled targets. SunSource ™ sputtering sources can be used in DC, pulsed DC, AC and RF modes.
Materials Science, Inc.
San Diego, CA
www.msi-pse.com
Tel: 1-858-483-3223
E-mail: jmiller@msi-pse.com
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Vacuum Technology & Coating