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Electron-Beam, Ion-Beam and Magnetron Deposition Sources
Compiled by Terrence Thompson, Contributing Editor
This annual product showcase covers new or improved electron-beam, ion-beam, magnetron and other deposition sources used in a wide variety of production, R&D and other applications.
Product Descriptions
In the following product descriptions, vendors make valid distinctions to focus on specific niche market segments so direct comparisons may be difficult. When in doubt, go to Vacuum Technology & Coating magazine’s home page at and click on on the advertiser links for additional details or telephone numbers for calling to discuss your specific application requirements. With their experience, they can help you make the right choices.
1” UHV Magnetron Sputter Gun – Source Head Fits Through 2.75" CF Flange
Finally, a UHV, magnetron sputter source that actually fits through the port of a 2.75• CF flange complete with its tilt gimbals assembly. Retrofitting UHV magnetron sputter sources into existing vacuum chambers can be difficult due to the availability and location of appropriate ports. With AJA International’s A310-XP, one only needs a 2.75" CF (CF38) to accommodate the source head, tilt gimbals and gas injection/ isolation chimney. The entire source can be extracted from the chamber without any disassembly. Target changes can be made with one hand either inside or outside of the chamber. This revolutionary new design is true UHV— all ceramic to metal construction. These sources can be combined into multi-gun clusters or be fitted with any sort of custom “goose necked” support tube to point at any spot in the chamber. The design is ideal for Surface Science chambers and anyone working with small substrates (up to 2" diameter). The A310-XP is suitable for RF and DC operation. www.ajaint.com
CT1210 Hollow Cathode Cylindrical Magnetron Sputtering Source For Simultaneous 360o Deposition Applications
AJA International, Inc. has  recently developed a new 12" ID, 10" deep, hollow cathode magnetron sputtering source. This source is designed to coat three-dimensional substrates from all sides simultaneously and features an internal gas distribution system to optimize uniformity. Targets can be made from one piece or material can be plasma sprayed onto a stainless steel backing cylinder. Custom sizes of this type of source and versions with two open ends (allowing continuous substrates to be coated, e.g. fibers, wires or ribbons) are also offered. Sources are available in both DC and RF versions. www.ajaint.com
A300-XP Series UHV Magnetrons With In-Situ Tilt for Exceptional Uniformity
AJA International, Inc. is  building many UHV magnetron sputtering systems featuring the unique in-situ tilt design (patent pending) delivering ± 1% film thickness uniformity over substrates twice the target diameter. The incident angle of the deposited material can be easily adjusted and reset when the working distance is changed or when the sources are serviced in any way. The precision of this design approach lends itself perfectly to the deposition of ultra thin film multilayers and co-deposited alloy films used in combinatorial chemistry research. Sizes rage from 1" to 10" diameter. Substrate heaters, RF/DC power supplies, targets and custom engineering also available. www.ajaint.com
Stiletto Series Magnetrons Economical HV Magnetrons With Extensive Features
With its Stiletto Series, AJA International, Inc. offers a wide range of economical, HV sputter magnetron sources for R&D and production applications. Target sizes range from 1" to 12" diameter for circular magnetrons and from 1.5" × 6" to 6" × 40" rectangular magnetrons. These RF / DC compatible sources feature AJA’s unique modular magnet array, internal or external mounting options, source head tilting capability and integral process gas injection. Custom engineered solutions are easily facilitated by the Stiletto Series' modular design. www.ajaint.com
Nautilus Series Rotating Magnetrons With Open Architecture Magnet Array
AJA International, Inc. has delivered over 100 Nautilus Series rotating magnetron sputter sources. The unique design of the Nautilus sources allows the magnet array to be precisely tuned to the application. This feature permits configuring the sources for maximum target utilization, maximum uniformity, intentional non-uniformity, balanced and unbalanced depositions, gradient depositions and varying stoichiometry for combinatorial chemistry studies. It is engineered for CD and DVD coatings and includes convenient process gas introduction and distribution. Custom engineered mounting and hinge solutions for target changing are readily available.
AJA International, Inc.
N. Scituate, MA
www.ajaint.com
Tel: 1-781-545-7365
E-mail: topgun@ajaint.com
CC-105 Cold Cathode Ion Source
The Denton Vacuum CC–105 Ion Source is one of the most stable, broad beam, ion sources on the market today.  Either running with argon in a reactive background, nitrogen or pure oxygen, the CC-105 will produce high-density, pinhole-free, moisture stable films for Precision Optics applications or applications where exact control of film properties is crucial. A 37-mm aperture and proprietary gas distribution provide a broad beam divergence for excellent coverage, while the dual filament configuration supports uninterrupted operation in the event of a filament failure. The independent gas control and water-cooled anode, coupled with Xantrex power modules provide stability and repeatability to this device. Low cost and compact, the Xantrex supplies come with a 5-year manufacturer warranty. This device is easily fitted to existing systems, or, is offered with each system sold by Denton. Process support is also available for new users. Through extensive process development, it is a highly stable device that is quickly gaining acceptance in the thin film industry. A high power CC series Ion Source will be available too in the near future.
Denton Vacuum, LLC
Moorestown, NJ
www.dentonvacuum.com
Tel: 1-856-439-9100 or toll-free 1-888-336-8661
E-mail: info@dentonvacuum.com
Complete Emitter Assemblies and Replacement Parts for Major Suppliers of E-Beam Systems
Fil-Tech, Inc. supplies complete emitter assemblies and replacement parts for major suppliers of e-beam systems. Replacement parts include filaments, insulators, beam formers, anodes, electromagnetic coils, and OFHC copper crucibles and covers. In addition, Fil-Tech supplies graphite, molybdenum and titanium crucible liners. Fil-Tech also supplies replacement parts for major manufactures of ion source systems. These replacement pars include tungsten filaments, a complete selection of insulators, and gas distributors in graphite, stainless steel and titanium. Fil-Tech also supplies anodes in graphite and stainless steel. Fil-Tech offers savings on hollow cathode replacement parts including cathode tips, keepers and required insulators. Fil-Tech also supplies Quality Crystals® in 6MHz and 5MHz styles with Gold, Longer Life Gold® , Stress Relieving Alloy® , and introducing Advanced Adhesion Alloy™ coatings. Choose the electrode material that best fits your deposition process. Gold offers low contact resistance and high chemical stability. Longer Life Gold offers low contact resistance and stress relieving qualities of alloy. Stress Relieving Alloy dissipates the stress from deposited dielectric materials to offer longer and steadier, jump free oscillation. Advanced Adhesion Alloy promotes greater film adhesion of deposited material on the crystal surface and works with alloy to dissipate stresses from dielectric materials.
Fil-Tech, Inc.
Boston, MA
www.filtech.com
Contact: G. Paul Becker
Tel: 1-617-227-1133 or toll free 1-800-743-1743
E-mail: paul@filtech.com
Speedflo Integrated Reactive Sputtering Solutions
For customers who do not require a complete turnkey facility, but would like a package of critical pre-configured components for their process needs, Gencoa has options. By combining the Speedflo reactive gas controller with Gencoa dual magnetrons, a customer has the components needed for success — just add the chamber, pumping and power. The integrated packages include sputtering hardware, process monitoring, process control software, reactive gas distribution and training. The package is pre-configured for the specific process needs to create the uniformity, process speed and performance you require. Typical applications include web-coating of dielectric stacks, precision optics/opthalmics, hard/low friction coatings, architectural glass and flat panel displays. Any material combination can be used with single or multi-channel gas control. Process monitoring can be via plasma emission or target voltage and the gas system is designed for fast feedback and uniformity adjustment. The magnetic design in the sputter cathodes is tuned to create the optimum plasma conditions for the process environment as a critical feature of the package. www.gencoa.com
Multi-functional Linear Ion Source
Gencoa has developed a flexible ion  source to satisfy the needs for both high energy and low energy cleaning of substrates. For aggressive cleaning, the source can be operated at 3kV to produce a high energy bombardment of glass and metal substrates. For temperature sensitive and web type substrates, the discharge voltage can be reduced to less than 500 volts to prevent damage. The sources come with a wide range of mounting options and have low cost, long-life and quick change anode/cathode parts. The anode material can be interchanged between metals and graphite. The use of a thick graphite anode allows high current densities to be used as result of the low sputter yield of carbon. Metal and alloy anodes can be used to provide sub-plantation (high-energy mode) or seed layers (low energy mode) on the cleaned surface.
Gencoa Ltd.
Liverpool, United Kingdom
www.gencoa.com
Contact: G. Paul Becker
Tel +44-0151-486-4466
E-mail: sales@gencoa.com
High Quality Sputtering Targets, Evaporation Materials
KAMIS offers high-quality sputtering targets, evaporation materials, crucible liners and other metals. For two decades, KAMIS has worked with the semiconductor industry, top research faculties and universities around the world. KAMIS has a wide variety materials that are in stock. KAMIS can also manufacture materials to your unique and specific requirements. KAMIS also provides quality service. For a specific question or requirement on sputtering targets, evaporation materials, crucible liners, metal foil, sheet, plate, rod and wire, KAMIS’ technical staff is ready with the expert knowledge to help you with your project.
KAMIS, Inc.
Mahopac Falls, NY
www.kamis.com
Tel: 1-845-628-6173
Linearly Moving Magnetron (LMM™ )
With KDF’s LMM™ technology, the plasma is swept across the target to achieve a uniform full-face target erosion and high target utilization. The LMM cathode is, by design, a superior technology in terms of process stability and repeatability from run-torun and over the target’s lifetime. This translates to higher productivity and cost savings. The linear moving magnet sputter cathode, a new patent applied for, full-face erosion rectangular design is available for all KDF systems. The LMM offers high material utilization with minimized re-deposition resulting in reduced particulates. The LMM enhanced design advances the capability to work in DC pulse reactive sputter mode with all materials. A Magterial version of the LMM is available providing the ultimate in utilization and lifetime when sputtering magnetic materials such as Nickel. www.kdf.com
Sputtering Targets
KDF has a large selection of  high purity metals, alloys, nonmetallic and cermets for virtually every sputtering and evaporation application in the industry. KDF’s facility manufactures production quantities of these materials but is also capable producing of small quantities for research applications at competitive prices. This manufacturing flexibility demonstrates commitment to actively anticipating and meeting the needs of customers. High purity sputtering targets are available in a variety of geometries, including planar, circular, conical, rectangular, ring, delta and custom configurations. KDF incorporates material processing techniques that include: Vacuum induction melting; vacuum/ inert hot pressing; hot/cold isostatic pressing; electron beam melting; and computer controlled machining. KDF supplies Chi, Mu, Muset (one piece) and Upsilon Inset™ Cathode™ target materials in a wide variety of materials. In addition KDF supplies conversion kits that enables conversion of existing Inset Cathode™ configuration from one style to another. All KDF manufactured targets are shipped with a Certificate of Conformance; Material Purity Certificate; and a MSDS (Material Safety Data Sheet) when required. Each target is chemically cleaned, marked and carefully packaged under vacuum or inert gas as required by the individual target. To preserve the purity of these targets, handle only with rubber gloves.
KDF Electronics
Rockleigh, NJ
www.kdf.com
Contact: Todd Plaisted, Director of Sales and Marketing
Tel: 1-201-784-5005
E-mail: todd@kdf.com
TORUS® R&D Magnetron Sputtering Guns
Proven reliability and performance for over 20 years. Lesker’s TORUS® sputtering guns have a long history of success in the sputtering of magnetic materials, insulators, semiconductors, or metals. With a wide variety of mounting styles TORUS Sputtering guns can fit into any application. We provide sputtering solutions, installation, service and training. Complete packages including power supplies are shown at www.lesker.com. Contact sputter@ lesker.com for more information.
TORUS® Production Magnetron Sputtering Guns
High performance Lesker sputtering guns for use in large area coatings and production applications. Production proven and patented magnet technology yields the highest target utilizations achievable, long target lifetimes, and greater up-times. Magnetrons with superior performance for magnetic materials and transparent conductive oxides are available. We provide sputtering solutions, installation, service, and training. Complete packages including power supplies are available at www.lesker.com. Contact sputter@ lesker.com for more information.
TORUS UHV Magnetron Sputtering Sources
The Kurt J. Lesker Company Torus® UHV magnetron sputtering sources are true UHV sources:  they are designed to be compatible with system base pressures below 10-10 Torr. The Torus UHV sources use no O-rings, and the magnet assembly is completely removable without breaking vacuum. These sources are equipped with a state of the art magnet assembly that can be adjusted in-situ. This allows the user to optimize the magnetic field (and thus the deposition characteristics) of the source for specific target materials. These true UHV sources are ideally suited for applications that require ultra pure films deposited in a true UHV environment. All Torus UHV sources utilize simple, clamped, disk shaped targets are RF, DC and pulsed DC compatible, are available in balanced and unbalanced versions, can be used to sputter metallic, magnetic, and insulating targets and can be supplied with numerous options including: direct gas injection, deposition chimneys, and cluster configurations. Torus UHV sources are available in 2-inch and 3-inch diameters and several insertion lengths. Contact sputter@lesker.com for more information.
LTE Thermal Organic Evaporation Sources
The Kurt J. Lesker Company’s LTE  evaporation sources are designed specifically for the deposition of organic thin films. The family of thermal evaporation (effusion) sources covers a range of temperatures required for thin film deposition of volatile, highly temperature sensitive organic or organic-metallic materials. The LTE Low Temperature Evaporation Source is ideal for depositing organic thin films requiring precise control (± 0.1 C) of source temperatures from 100°C to 600°C. The “plug-in” design feature makes material replenishment and maintenance efficient and trouble free. This source is available with effusion cell capacities from 1cc and up to 35cc. Complete packages including power supplies are available at www.lesker.com. Contact organicdep@lesker.com for more information or to discuss evaporation needs.
HTE Thermal Evaporation Sources
Kurt J. Lesker Company’s HTE evaporation sources offer a highly controllable alternative to traditional thermal evaporation. The high temperature furnace offers direct thermocouple control of evaporation for a range of materials up to 1500°C. The UHV compatible construction, small footprint, and outstanding temperature control make the HTE thermal evaporation source an ideal alternative to expensive Knudsen cells. This source is available with capacities from 1cc and up to 35cc. Complete packages including power supplies are available at www.lesker.com. Contact thermaldep@lesker.com for more information.
KJLC Thermal Evaporation Sources
The Kurt J. Lesker Company manufactures resistive thermal evaporation sources for use in many types of decorative and research and development applications. These thermal evaporation sources are either filament coiled, metal boat, or crucible type, and are mounted onto a 2.75-inch CF flange with linear motion also available. The sources utilize a Kurt J. Lesker Company manufactured power supply for operation in various power ranges. Contact thermaldep@lesker.com for more information.
KJLC Thermal Evaporation Kits The Kurt J. Lesker Company manufactures sequential and co-deposition versions  of this platform for use in production and R&D application. The kit is supplied with all relays, switches and shutters needed for a variety of thin film depositions. This platform can be configured to use filaments, boats or crucibles. The Standard mounting flanges are an ISO 250 or 12" CF with custom mounting options available. Complete packages including power supplies are shown at www.lesker.com. Contact thermaldep@lesker.com for more information.
KJLC Ion Sources
The Kurt J. Lesker Company’s lines of filamentless DC ion sources are ideal for applications involving ion assisted deposition, plasma cleaning, oxiding, nitriding, as well as surface modification. Lesker ion sources are UHV and reactive gas compatible and use no thermionic emitter so that they may be operated in inert environments. Each ion source includes the ion source, power supply, cabling, feedthroughs, flexible internal utilities, remote swivel/rotating mounting collar (flange mount is optional), and choice of molybdenum or graphite grids. Kurt J. Lesker Company offers the following filamentless DC ion sources: 3 cm, 5 cm and 10 cm. Contact ionsource@lesker.com for more information.
Full Range of Sputtering Targets and xsThermal Evaporation Supplies
The Kurt J. Lesker Company offers  a full range of sputtering targets and thermal evaporation supplies, many of which are stocked for immediate shipment. Our manufacturing capabilities include targets up to 16" diameter or linear lengths of up to 150". Lesker Materials also stocks a huge assortment of popular metals and inorganics for e-beam and thermal evaporation. Through ISO 9001:2000 Certification we are better able to serve our thermal evaporation and magnetron sputtering customers' needs. Request a free copy of our Materials Deposition chart at www.lesker.com or give us a call to see how we can meet your sputtering or evaporation materials requirements.
Kurt J. Lesker Company
Clairton, PA
www.lesker.com
Contact: Justin Poziviak
Tel: 1-800-245-1656 or 1-412-387-9200
E-mail: salesus@lesker.com
SunSource™ GEN II High Utilization Narrow Width Sources
A new line of Materials Science, Inc.  SunSource™ GEN II magnetron sputtering sources with 90mm wide targets featuring 40wt% utilization during the useful target life has been developed. They are ideal for sputtering precious metals and expensive, hard to fabricate materials used in the production of photovoltaic devices. Good target utilization can be achieved even at very low power levels. An important benefit is that there is virtually no center material redeposition. These sources are a cost-effective alternative to rotary magnetrons in many applications. The plasma discharge is confined to the region above the target surface due to the highly balanced magnetic design. No strong stray electromagnetic fields are generated that promote arcing, substrate damage and heating from electron and ion bombardment and sputtering of the source itself. They are ideally suited for small vacuum web coaters – Distribution from the source is more easily matched to the circumference of the drum. Flange mount, internal mount and retrofit configurations are available with a variety of feedthrough and utility connection possibilities. www.msi-pse.com
SunSource™ GEN II Linear Sputtering Sources with Kamlok™ Fast Target Exchange System
Materials Science, Inc. SunSource™ GEN II magnetron sputtering sources include the  Kam-Lok™ (patent pending) fast target change mechanism that eliminates target fasteners prone to galling and seizure – targets are exchanged quickly regardless of length. Gas injection through the cathode body & efficient cooling ensure uniform distribution, high rates & low pressure operation. A wide uniform target erosion area results in stable reactive sputtering, high target utilization and virtually no center material re-deposition. They can be used in DC, pulsed DC, AC and RF modes. They are available in internal and flange mount configurations in lengths up to several meters in a variety of target widths. www.msi-pse.com
SunSource™ High Target Utilization Sputtering Sources
Materials Science, Inc. SunSource™ round and rectangular sputtering sources feature the highest real target utilization of any planar magnetron available. Utilization varies from 40-45 wt% during the useful target life depending upon the target width and thickness. An active plasma discharge on nearly entire target surface significantly reduces insulating film growth and arcing and promotes stable operation. Target erosion is uniform throughout the target lifetime without significant changes in distribution uniformity as the target erodes. There is virtually no center re-deposition and the active plasma is confined to the target surface - target clamps and shields are not sputtered and consumed. There are no “wiggles” down the length of the racetrack and no premature burn-through at the ends of linear sources.
Materials Science, Inc.
San Diego, CA 92109
www.msi-pse.com
Tel: 1-858-483-3223
E-mail: jmiller@msi-pse.com
Miniature Evaporation Systems—e-Vap® Mighty Source™ —4 Pocket Evaporation Source
MDC introduces the e-Vap® Mighty Source™ — a 4 pocket × 2cc rotary electron  beam source. Affordable and extremely compact, it stands just 2.4-inches tall by 4-inches long by 2.8-inches wide. The Mighty Source™ is rated for 3 kilowatts of power that makes it an ideal deposition tool for evaporating metals, oxides, metal-oxides, and magnetic materials. Designed into the source body are two hermetically-sealed XY-axis sweep coils that allow users to sweep the electron beam across the crucible  pocket, resulting in the maximization of your coating process in terms of material stability and consistency. The Mighty Source™ design is specifically tailored for the following uses pilot production, lab/R&D applications, and the university marketplace. Its compact design features allow it to be mounted onto a 2- 3 /4-inch Del-Seal CF flange or onto a 6-inch or 10-inch Del-Seal CF flange in either horizontal or vertical configurations. To complete this product system, MDC also offers a 3kw power supply and low cost XY sweep controller. www.mdcvacuum.com
e-Vap® Modular Evaporation Sources—Individual Source
MDC’s modular e-Vap® sources are state-of-the-art electronbeam evaporation sources designed  for the demanding and exacting world of vacuum coatings. This selection of electron-beam evaporation sources provides vacuum coating solutions for most applications including medical, metallurgical, telecommunications, microelectronics and optics. Modular sources are offered in six standard frame sizes and are stand alone components for maximum installation flexibility in existing vacuum systems. For those requiring standard off-the-shelf solutions, complete horizontal and vertical flange mounted systems are also available. Modular sources are fitted with direct water-cooled crucibles. Select models have indirectly cooled crucibles that allow the user to change crucibles without interrupting the flow of water to the source and without having to disassemble the source. Modular sources are offered with material capacities from 6cc to 400cc in a multitude of pocket geometries and arrangements. They are available in both fixed and rotary pocket mechanisms for high and ultrahigh vacuum environments. e-Vap® modular sources are designed for optimum performance with e-Vap® power supplies, controls and electronics. Other essential components and hardware required for the installation of e-Vap® modular sources are detailed starting on page. Custom electron-beam evaporation sources are available. www.mdcvacuum.com
Horizontal Source Assembly
MDC has eliminated the difficulties  of flange mounting electron beam sources. Problems associated with designing and fitting sources into coating systems are solved with the introduction of standard horizontal flange mounted evaporation sources. The compact footprint of these flanged evaporation systems allows the installation of up to three individual sources onto one ten-inch chamber. The flanged assemblies include an electron beam source with all water and electrical connections. A guide rod option provides a drawer like sliding action for installation and system maintenance. Horizontal flange mounted assemblies come ready to accept this guide rod kit. Another option includes a watercooled roof, which mounts directly above the e-Vap® source. The water-cooled roof acts as a heat barrier between the source and substrate and also prevents vapor condensation on chamber walls. The water-cooled roof is fitted with a deposition port angled towards the substrate, which aids in deposition uniformity, even when source and substrate centerlines are offset. Horizontal systems purchased with a source control module are fitted with flange-mounted filament transformers. www.mdcvacuum.com
Vertical Source Assembly
MDC has eliminated the difficulties of flange mounting electron beam sources. The effort that goes into designing and fitting a source to a vacuum coating chamber has been done for you with the introduction of standard vertical flange mounted evaporation sources. The flanged assembly includes one 7cc electron beam source with all water and electrical connections. This type of flange mounted system is typically installed vertically through the bottom side of a chamber. The compact footprint of these flanged evaporation systems requires only one port flange for installation. A popular option commonly ordered with these systems is a water-cooled roof, which mounts directly above the e-Vap® source. The water-cooled roof acts as a heat barrier between the source and substrate and also prevents vapor condensation on chamber walls. The water-cooled roof is fitted with a deposition port, angled towards the substrate, which yields excellent deposition uniformity, even when source to substrate centerlines are offset. The singlepocket source comes standard with a 7cc capacity crucible. The same assembly can be fitted with larger capacity sources including 15, 25 and 40cc versions. To order the larger volume crucible option add one of the three option numbers to the end of the assembly part number. Vertical systems purchased with a source control module will be fitted with flange-mounted filament transformers. www.mdcvacuum.com
Custom Source and Source Assemblies
Custom source and source assemblies can be designed to fit an existing chamber or for a special application. Contact MDC for details regarding custom source assemblies or custom sources. They are available in six frame sizes; single, multipocket or carousel crucibles; custom crucible configurations available; crucible sizes from 6cc to 400cc; power ratings from 6kW to 15kW; and direct or indirect water cooling.
MDC Vacuum Products Corporation
Hayward, CA
www.mdcvacuum.com
Contact: Jinny Royer
Tel: 1-510-265-3500 or toll free 1- 800-443-8817
E-mail: JRoyer@mdcvacuum.com
Baffled Box Sources for SiO, ZnS
The R. D. Mathis Company “Baffled Box” silicon monoxide source (SiO) source, has proven to be successful for depositing silicon monoxide. The source material is positioned in the boat within separate cavities, when heated it follows an indirect path through a series of baffles and then out of the exhaust chimney. The substrate cannot see the bulk material at any time. This essentially eliminates any chance of spitting and streaming that causes pinhole type defects. Many sources are available with up, down or horizontal exhaust ports. Custom fabrication and larger volume sources to fit your specific process needs are available upon request.
The R.D. Mathis Company
Long Beach, CA
www.rdmathis.com
Tel: 1-562-426-7049
E-mail: info@rdmathis.com
High-Performance Cathodes Sierra Applied Sciences, Inc., is an industry leader in highperformance cathode technology. With our superior designs, customization and diverse cathode product lines, we can support and address any complex deposition application for all customers ranging from decorative to magnetic media. We also offer advanced customized designs for ITO applications that allow for lowest possible voltage operation and the highest conductivity films possible in the market today. These types of innovated designs, along with our patented magnetics allows our customers to achieve the highest target utilization possible with far superior quality films compared to our competition. We also offer the largest variety of cathode sizes, configurations, and mounting options for today's complex applications. We at Sierra support our products with the highest level of quality and service our customers require. Once units are delivered, we're there for all and any after market customer support for the life of our products. Close to 80% of our annual business is from repeat customers who only choose to buy from Sierra. Sierra’s pre-purchase performance and best price guarantee makes buying easy and risk free.
Sierra Applied Sciences, Inc.
Boulder, CO
www.sierraapplied.com
Tel: 1-303-440-0861
E-mail: info@sierraapplied.com
E-Beam Sources
Telemark offers one of the broadest ranges of multi-pocket rotatable, single pocket UHV, and linear UHV electron beam sources. Options for arc-suppression sources, reduced beam curl magnetics sources, self-sealing cover plates, large inventory sources and crucibleless sources are available on specific models. Rugged, reliable construction; designed for ease of use and maintainability; side or bottom crucible rotation drive; plug-in emitter assembly for easy filament replacement; all components are maintained in stock. www.telemark.com
E-Beam Tetrode Power Supplies
 Telemark produces a wide range of general purpose and production power supplies for electron bem systems. Power ranges are 3 kW, 6 kW, 8 kW, 10 kW, 15 kW, and 20 kW in the rugged and reliable Tetrode Tube style for maximum flexibility and field serviceability. Dual and triple source options available on the 10 kW and 15 kW models. All supplies come with standard X-Y Sweep controllers with several built-in and adjustable patterns or can be upgraded to fully programmable “Cheetah” X-Y sweep controllers.
Telemark
Hayward, CA
www.telemark.com
Contacts: Gary Henderson, President or Kim Vally, Sales Assistant
Tel: 1-510-887-2225
E-mail: sales@telemark.com
Thin Film and Nanotechnology Sources
Torr International, Inc.  specializes in Thin Film & Nanotechnology Equipment. The current range of products include Standard Table Top low-priced Magnetron Sputtering systems for diverse applications, from specimen preparation for SEMs to R&D with metal, dielectric and polymer films to Custom-built multi-target sophisticated systems for special applications. We also manufacture Thermal and E-Beam Evaporation systems to suit customers' needs and specialize in Etching systems with different configurations for corrosive and standard applications. We serve a worldwide market in the areas of Thin Film Deposition and Etching as well as high vacuum technology. We also supply all the accessories needed for Thin Film Deposition work.
Torr International, Inc.
New Windsor, NY
www.torr.com
Tel: 1-845-565-4027 or 1-845-565-6637
E-mail: torr@torr.com
Anode Linear Layer Sources
Veeco’s high power anode layer ion sources are scalable in either circular or linear geometries in excess of three meters and feature high current density operation from high vacuum up to milliTorr pressure ranges. The sources provide both gridless and filamentless operation with all inert and reactive gases. The sources’low maintenance, independent beam energy and current control make them excellent for processes requiring long, uninterrupted production runs. Round and linear anode layer sources are ideal for a wide variety of applications, such as architectural/automotive glass, flat panel displays, web coating, ophthalmic, precision optics, data storage and semiconductor. Veeco offers the following Anode Layer Ion Sources: ALS40C; ALS340L; ALS1000L; ALS1500L; ALS2540L; and ALS3250L. www.veeco.com
Isoflux Cylindrical Magnetrons
Veeco brings its considerable  ion beam experience to our Isoflux Cylindrical Magnetrons (ICM). These sputtering sources use cylindrical targets to surround the substrate with coating materials. Used to coat complex 3-dimensional shapes, wires and fibers the ICM design is more efficient than planar magnetrons and offers high deposition rates, excellent target utilization, less downtime and relatively inexpensive targets. Veeco offers the following Isoflux Cylindrical Magnetrons: ICM-516; ICM-1921; and ICM-3421. www.veeco.com
Gridded RF Ion Sources
Veeco’s filamentless RF ion  sources are low maintenance and ideal for processes using 100% argon, oxygen or other reactive gases. They come in either circular or linear geometries. RF sources produce broad, uniform, monoenergetic ion beams in both inert and oxidizing environments.An optional 4-grid design offers very high collimation. In addition, these sources have very long maintenance intervals, making them ideal for both batch and loadlocked production processes. Veeco offers the following RF Ion Sources: 3 cm RF; 6 cm RF; 12 cm RF; 16 cm RF; 16 cm High Power RF; 6 × 22 cm RF; 6 × 66 cm RF; and 6 × 110 cm RF.
Veeco Instruments Inc., Ion Sources
Fort Collins, CO
www.veeco.com
Contact: Mike Meyer
Tel: 1-970-221-1807 Ext. 297
E-mail: mmeyer@veeco.com
Pre-Melted Refractory Oxide Evaporation Materials
CERAC, Inc., a subsidiary of  Williams Advanced Materials now offers a series of pre-melted refractory oxide evaporation materials that are designed for immediate use in your evaporation process. These products deliver cost savings by reducing pre-processing time in the coating chamber, thus reducing nonproductive chamber periods. Their increased density over sintered materials allow for longer coating runs as well minimized outgassing/spit- ting behavior provides improved coating yields for challenging applications. Cones, rods, discs and pieces are manufactured using either our own raw materials, or our customer’s currently qualified source material. We offer standard size e-beam coating platforms, or products can be customized to fit any individual crucible or pocket. These value-added products are supported worldwide with an infrastructure of sales, support and specialized technical assistance. The standard line of pre-melted materials currently includes Al2O3, HfO2 (white or black), Ta2O5, TiO2 and ZrO2. www.williams-adv.com
EVAPro™ Evaporation Materials
Williams Advanced Materials’  evaporation products have reached a higher level of performance! Our EVAPro™ process technology produces higher yields when evaporated onto compound semiconductor wafers, minimizing defects caused by splattering. EVAPro™ evaporation materials contain ultralow gas entrapments that ensure defect-free devices. Some of the benefits of this new process include minimal defect count from start to finish, ideal alloy homogeneity, stable evaporation process parameters and optimal precious metal usage per run
Williams Advanced Materials Inc.
Buffalo, NY
www.williams-adv.com
Contact: Kim Schoen, Marketing Specialist
Tel: 1-716-446-2238
E-mail: Kimberly_Schoen@beminc.com
“Ultra Source” Multi-Hearth Electron Beam Source
The new Yeagle Technology,  Inc. “Ultra Source” retains all the advantages of the original Sloan E-Beam source, large hearth capacity, high deposition rates, long filament life, and industrial reliability, but has been re-engineered. There is no need to disconnect water fittings when disassembling the source for routine maintenance. All wear surfaces are now stainless steel instead of copper. Water leaks caused from removing the hearth have been eliminated. The Ultra Source shares many of the same components as the original Sloan source — expendables, magnets, anodes, beam formers, filament blocks and many other parts are all compatible. Features include a large pocket (up to 40 cc), interchangeable crucibles, 270 bent beam design for longer filament life, high operating efficiency and X-Y sweep capability.
Yeagle Technology, Inc.
Ashford, CT
www.ytionline.com
Contact: Bobbie Ross, Vice President
Tel: 1-860-429-1908
E-mail: bobbie@ytionline.com
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Vacuum Technology & Coating